description: socket (frh, 1.00mm pitch) guide box mat?l: high t emp. liquid cryst al polymer (lcp)index: -40c to 260c (-40f to 500f) base mat?l: fr-4 glass filled epoxy index: -40c to 140c (-40f to 284f) socket size: 3.00mm wider and 10.00mm longer than bga device (for p ackages larger than 15.00mm square).* flip-top tm bga sockets 1.27mm and 1.00mm pitch flip-top tm bga sockets 5 energy w ay , w est w arwick, ri 02893 usa t el: 800.424.9850 | 401.823.5200 fax: 401.823.8723info@advanced.com | www .advanced.com cat alog 16a products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) smt models are shipped un-assembled to ease solderability . thru-hole models are shipped fully assembled. 1. lower assembly is soldered to pc board with no external hold-down mechanism. thru-hole models may be soldered to pc board or plugged into a matingsocket. 2. upper assembly insert s easily to lower assembly by aligning guide post s and inst alling four (supplied) screws. 3. finned heat sink or coin screw is screwed down to flush with bottom of lid. 4. lid opens easily by pressing latch.5. bga device is inserted by aligning a1 position with chamfered corner of flip-t op? socket. place support plate on top of device, close lid, engage heat sink orcoin screw , and socket is ready for use. det ailed inst allation and general usage instructions are provided with product. specifications: terminals: brass - copper alloy(c36000) astm-b-16 contacts: ber yllium copper (c17200) astm-b-194 plating: g - gold over nickel terminal support: polyimide film spring material: stainless steel lid, latch, heat sink/coin screwand support plate material: aluminum solder ball: standard: 63sn/37pblead-free: 95.5sn/4.0ag/0.5cu features: ? designed to save space on newand existing pc boards in test, development, programming and production applications. ? no external hold-downs or soldering of bga device required. ? aic exclusive solder ball terminals offer superior processing. ? uses same footprint as bga device.? a vailable with integral, finned heat sink or coin screw clampassembly . table of models description: socket (frg , 1.27mm pitch) guide box and base mat?l: high t emp. liquid cryst al polymer (lcp) index: -40c to 260c (-40f to 500f) socket size: 3.00mm wider and 10.00mm longer than bga device (for p ackages larger than 15.00mm square).* how it works footprint dash # if applicable* 1 fr g xxxx - 821 g g xx contact plating terminal plating terminal type model type rohs compliant insulator: fr - flip-top? bga socket number of positions see options rohs compliant: g - gold rohs compliant: g - gold pitch g = .050/(1.27mm)h = .039/(1.00mm) *see footprints section or online database. clamp options hs - heat sink (3 fins std.) cs - coin screw frg replaces ftg . * for device p ackages smaller than 15.00mm square, the socket size is x = .709/(18.00) and y = .984/(25.00). chip support plate(supplied) bga or lga deviceupper assembly lower assembly see p age 15 for generic reflow profiles. how to order
flip-top tm bga sockets 1.27mm and 1.00mm pitch flip-top tm bga sockets 5 energy w ay , w est w arwick, ri 02893 usa t el: 800.424.9850 | 401.823.5200 fax: 401.823.8723info@advanced.com | www .advanced.com cat alog 16a products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) footprints: ? full grid molded insulatorspopulated to exact device pattern. ? over 1000 footprints available -see page 99, sear ch online or submit your device specs. ? use our build-a-part feature orsear ch in our online bga socket finder tm at www .bgasockets.com. .906 sq. (23.00) .039/(1.00) typ. 360 pins footprint number 360-2 22 x 22 rows available online: ? rohs qualification t est report ? t echnical articles ? t est data ? signal integrity per formance ? cad drawings ? bga footprints terminals (for test, development and production applications) .030 dia. (0.76) .102 (2.59) .206 (5.23) 1.00mm pitch 1.27mm pitch smt (surface mount) .024 dia. (0.61) .091 (2.31) .200 (5.08) type -708 type -754 .102 (2.59) .125 (3.18) .018 dia. (0.46) .176 (4.47) thru-hole .091 (2.31) .125 (3.18) .010 dia. (0.25) .176 (4.47) terminals (for lga or de-balled bga device applications) tin/lead: type -713 lead-free: type -822 .112 (2.84) .030 dia. (0.76) .206 (5.23) 1.00mm pitch 1.27mm pitch smt (surface mount) .099 (2.51) .024 dia. (0.61) .200 (5.08) type -712 type -763 .112 (2.84) .125 (3.18) .018 dia. (0.46) .176 (4.47) thru-hole .099 (2.51) .125 (3.18) .010 dia. (0.25) .176 (4.47) terminals (for bga device test applications) tin/lead: type -659 lead-free: type -820 .030 dia. (0.76) .102 (2.59) .206 (5.23) 1.00mm pitch 1.27mm pitch smt (surface mount) type -657 type -tbd .125 (3.18) .018 dia. (0.46) .102 (2.59) .176 (4.47) thru-hole a vailable with .016/(0.41mm) diam. t ail; t ype -709 consult factory consult factory tin/lead: type -690 lead-free: type -821 tin/lead: type -752 lead-free: type -837 tin/lead: type -762 lead-free: type -838 tin/lead: type -tbd lead-free: type -tbd
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